Products - Embedded Computing

Innovative Memories
& Embedded Systems

At 2” X 2” X 2”, the AS-CUP is the world’s tiny computer EVER. With its sleek and elegant design, the AS-CUP easily blends into your home or office décor. You’ll hardly notice it, but when you do, you’ll love the way it looks.

AS-CUP-iMX6 gives engineers a unique set of off- the-shelf design features and benefits enabling: shorter time to market, lower design cost, and reduction in projects’ risks. The enriched interfaces supports all common industrial and automotive needs, added with Bluetooth, Wi-Fi, HDMI, LVDS, touch display, audio, PCIexpress, SATA, and more. These features and benefits make the AS-SOM a common broad solution for many applications.


(DQ) Denotes only at dual & quad core
*Standard I/Fs included at all configurations

  • SOC i.MX6: solo, dual lite, dual, quad core
  • *SOC speed 1GHz
  • 512MB-4GB DDR3 SDRAM
  • *microSD interface
  • *HDMI 1080 W/ CEC 1.4 3D support
  • WIFI 11/ Bluetooth (Q), optional on other
  • Micro USB to RS-232 (DQ)
  • eSATA2 3Gbps (DQ)
  • RTC with backup battery (DQ)
  • Infrared for remote control receiver or receiver & transmitter (DQ)
  • GPU Vivante GC880 or GC2000
  • *3D GPU OpenGL ES1.1/2.0; also OpenCL 1.1E (DQ)
  • *Optical S/PDIF audio out
  • HW video Dec/Enc *multi format
  • *1x Ethernet 10/100. 1000 Gbit/s (DQ)
  • *USB: powered 2X host
  • *OS – Android 4.4.2 or Linux (No Android on solo), XBMC
  • Power: operation 5V.
  • Operating temperatures – commercial 0°C to 70°C and industrial -45°C to +95°C; OEM optional -55°C to +100°C
  • Storage temperature -55°C to +100°C
  • Humidity 5% to 95% relative, non-condensing
  • Reliability - MTBF - 1,000,000 hours MIL-HDBK271F
  • Heat dissipation balancing for demanding applications
  • Sustained environmental: shock - half sine, 40G peak, 11ms; half Sine, 1500G (3 axes); vibration - 16.3G RMS (random, 20Hz to 2000 Hz, 3 vibrations axes)


pdfAS-CUP System iMX6